Peter Menkhorst; Danny Rogers; Rohan Clarke; Jeff Davies; Peter Marsack; Kim Franklin Princeton University Press (2017) Saatavuus: Tulossa! Pehmeäkantinen kirja
Peter Menkhorst; Danny Rogers; Rohan Clarke; Jeff Davies; Peter Marsack; Kim Franklin CSIRO Publishing (2017) Saatavuus: Hankintapalvelu Pehmeäkantinen kirja
Peter Menkhorst; Danny Rogers; Rohan Clarke; Jeff Davies; Peter Marsack; Kim Franklin CSIRO Publishing (2019) Saatavuus: Hankintapalvelu Pehmeäkantinen kirja
Nancy Kendall; Denise Goerisch; Esther C. Kim; Franklin Vernon; Matthew Wolfgram Springer Nature Switzerland AG (2020) Saatavuus: Tilaustuote Kovakantinen kirja
Jeff Davies; Peter Menkhorst; Danny Rogers; Rohan Clarke; Peter Marsack; Kim Franklin Princeton University Press (2023) Saatavuus: Hankintapalvelu Kovakantinen kirja
Chung H. Chuong; Dorothy Cordova; Robert H. Hyung Chan Kim; Steve Fugita; Franklin Ng; Jane Singh Bloomsbury Publishing Plc (1999) Saatavuus: Tilaustuote Kovakantinen kirja
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.