John P Kaminski; Thomas H Linley; Timothy D Moore; Sarah K Danforth; Dustin M Cohan; Oindrila Chattopadhyay; Schoenleber Wisconsin Historical Society Press (2021) Saatavuus: Hankintapalvelu Kovakantinen kirja
John P Kaminski; Thomas H Linley; Timothy D Moore; Sarah K Danforth; Dustin M Cohan; Oindrila Chattopadhyay; Schoenleber Wisconsin Historical Society Press (2021) Saatavuus: Hankintapalvelu Kovakantinen kirja
John P Kaminski; Thomas H Linley; Elizabeth M Schoenleber; Timothy D Moore; Oindrila Chattopadhyay; Dustin M Cohan; Bierme Wisconsin Historical Society Press (2020) Saatavuus: Hankintapalvelu Kovakantinen kirja
John P Kaminski; Thomas H Linley; Elizabeth M Schoenleber; Timothy D Moore; Dustin M Cohan; Oindrila Chattopadhyay; Bierme Wisconsin Historical Society Press (2023) Saatavuus: Tulossa! Kovakantinen kirja
John P Kaminski; Thomas H Linley; Elizabeth M Schoenleber; Timothy D Moore; Dustin M Cohan; Oindrila Chattopadhyay; Bierme Wisconsin Historical Society Press (2023) Saatavuus: Tulossa! Kovakantinen kirja
Philip J. DiSaia; Gautam Chaudhuri; Linda C. Giudice; Thomas R. Moore; Lloyd H. Smith; Manuel M. Porto Elsevier Health Sciences (2012) Saatavuus: Tilaustuote Pehmeäkantinen kirja
John Fl - Badcock; Thomas M (Thomas Moore) Smith; John S (John Stuart) - Skinner Creative Media Partners, LLC (2016) Saatavuus: Tilaustuote Kovakantinen kirja
Charles J. Lockwood; Thomas Moore; Joshua Copel; Robert M Silver; Robert Resnik Elsevier Health Sciences (2018) Saatavuus: Loppuunmyyty Kovakantinen kirja
Ann R Cannon; George W Cobb; Bradley A Hartlaub; Julie M Legler; Robin H Lock; Thomas L Moore; Allan J Rossman; J Witmer W. H. Freeman (2018) Saatavuus: Hankintapalvelu Kovakantinen kirja
Ann R Cannon; George W Cobb; Bradley A Hartlaub; Julie M Legler; Robin H Lock; Thomas L Moore; Allan J Rossman; J Witmer W. H. Freeman (2018) Saatavuus: Hankintapalvelu Irtolehti
Charles J. Lockwood; Thomas Moore; Joshua Copel; Robert M Silver; Robert Resnik Elsevier Health Sciences (2022) Saatavuus: Tilaustuote Kovakantinen kirja
Momentum Press Asu: Kovakantinen kirja Julkaisuvuosi: 2010, 16.04.2010 (lisätietoa) Kieli: Englanti
With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Readers will find:
General overview of IC package reliability testing
Characterization for the electrical performance of IC packages
Understanding surface characteristics and interfaces for thermal management
Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more
