Stress-Induced Phenomena in Metallization : Ninth International Workshop on Stress-Induced Phenomena in Metallization, Ogawa, Shinichi (ed.); Ho, Paul S. (ed.); Zschech, Ehrenfried (ed.), American Institute of Physics

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Stress-Induced Phenomena in Metallization : Ninth International Workshop on Stress-Induced Phenomena in Metallization

Shinichi Ogawa (ed.), Paul S. Ho (ed.), Ehrenfried Zschech (ed.)

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American Institute of Physics
Sivumäärä: 204 sivua
Asu: Kovakantinen kirja
Painos: 2007
Julkaisuvuosi: 2007, 13.11.2007 (lisätietoa)
Kieli: Englanti
Tuotesarja: Materials Physics and Applications

The conference was on reliability related science in ULSI interconnect. Its main purpose was to discuss the stress induced phenomena in the LSI interconnect among academic researchers and industry engineers to establish academic science and to improve the reliability of ULSI chips. All papers were peer reviewed.

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