Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.

Table of Contents


Front Matter
Executive Summary
Backgorund
State of the Art of Wide Bandgap Materials
Device Physics: Behavior at Elevated Temperatures
Generic Technical Issues Associated with Materials for High-Temperatures...
High-Temperature Electronic Packaging
Device Testing for High-Temperature Electronic Materials
Conclusions and Recommendations
References
Appendix A: Silicon as a High-Temperature Material
Appendix B: Gallium Arsenide as a High Temperature Material
Appendix C: High-Temperature Microwave Devices
Appendix D: Biographical Sketches of Committee Members