Stress-Induced Phenomena in Metallization : Seventh International Workshop on Stress-Induced Phenomena in Metallization, Ho, Paul S. (ed.); Baker, Shefford P. (ed.); Nakamura, Tomoji (ed.); Volkert, Cynthia A. (ed.), American Institute of Physics

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Stress-Induced Phenomena in Metallization : Seventh International Workshop on Stress-Induced Phenomena in Metallization

Paul S. Ho (ed.), Shefford P. Baker (ed.), Tomoji Nakamura (ed.), Cynthia A. Volkert (ed.)

148,80 €

American Institute of Physics
Sivumäärä: 250 sivua
Asu: Kovakantinen kirja
Painos: 2004
Julkaisuvuosi: 2004, 14.12.2004 (lisätietoa)
Kieli: Englanti

These proceedings contain new research results and advances in basic understanding of stress-induced phenomena in metallization. Papers cover results on electromigration, thermal stresses and void formation in copper-low k interconnect structures.

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