Heat transfer is one of the most common physical phenomena. Most devices include heat sources and heat exchange with the environment. The problem of thermal management has become essential in many industrial sectors. It especially impacts the electronics industry for many years due to the increasing density of components. Thereby, the effects of significant overheating during thermal cycling in electronic components are numerous and affect both the reliability and durability of components and power circuits, compromising the operation and safety of complex systems. Furthermore, the sharing of a common thermal environment increasingly restricted by several heat sources makes the thermal coupling between critical and unpredictable components especially as cooling paths can be multiple. With regards to engineering heat transfer, this book discussed the applied thermal process, the work on the temperature control component. The research objects are addressed experimentally and numerically and lead to innovative design, also made in laboratory. The design of engineering project and development of model for heat transfer process are also carried out on this book to enable the study of systems and to optimize the design.