SULJE VALIKKO

avaa valikko

Microelectronic Packaging
304,50 €
Taylor & Francis Ltd
Sivumäärä: 564 sivua
Asu: Kovakantinen kirja
Painos: 1
Julkaisuvuosi: 2004, 20.12.2004 (lisätietoa)
Kieli: Englanti
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.

Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.

Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Tuotetta lisätty
ostoskoriin kpl
Siirry koriin
LISÄÄ OSTOSKORIIN
Tilaustuote | Arvioimme, että tuote lähetetään meiltä noin 1-3 viikossa. | Tilaa jouluksi viimeistään 27.11.2024. Tuote ei välttämättä ehdi jouluksi.
Myymäläsaatavuus
Helsinki
Tapiola
Turku
Tampere
Microelectronic Packagingzoom
Näytä kaikki tuotetiedot
ISBN:
9780415311908
Sisäänkirjautuminen
Kirjaudu sisään
Rekisteröityminen
Oma tili
Omat tiedot
Omat tilaukset
Omat laskut
Lisätietoja
Asiakaspalvelu
Tietoa verkkokaupasta
Toimitusehdot
Tietosuojaseloste