Zhiyuan Li (ed.); Pen-Chung Yew (ed.); Siddharta Chatterjee (ed.); Chua-Huang Huang (ed.); P. Sadayappan (ed.); David Sehr Springer (1998) Pehmeäkantinen kirja
Gang Li (ed.); Qiang Hu (ed.); Olga Verkhoglyadova (ed.); Gary Zank (ed.); R.P. Lin (ed.); J. Luhmann (ed.) American Institute of Physics (2008) Kovakantinen kirja
Springer Sivumäärä: 437 sivua Asu: Kovakantinen kirja Julkaisuvuosi: 2009, 16.10.2009 (lisätietoa) Kieli: Englanti
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
