Luc Claesen | Akateeminen Kirjakauppa

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VLSI-SOC: INTERNET OF THINGS FOUNDATIONS : 22ND IFIP WG 10.5/IEEE INTERNATIONAL CONFERENCE ON VERY LARGE SCALE INTEGRATION, VLSI

Luc Claesen (ed.); Maria-Teresa Sanz-Pascual (ed.); Ricardo Reis (ed.); Arturo Sarmiento-Reyes (ed.)
Springer (2015)
Kovakantinen kirja

49,60 €

VLSI-SOC: INTERNET OF THINGS FOUNDATIONS - 22ND IFIP WG 10.5/IEEE INTERNATIONAL CONFERENCE ON VERY LARGE SCALE INTEGRATION, VLSI

Luc Claesen; Maria-Teresa Sanz-Pascual; Ricardo Reis; Arturo Sarmiento-Reyes
Springer International Publishing AG (2016)
Pehmeäkantinen kirja

49,60 €

VLSI

Reis Ricardo A. Reis; Claesen Luc Claesen
Springer Nature B.V. (2013)
Pehmeäkantinen kirja

107,50 €

VLSI: INTEGRATED SYSTEMS ON SILICON - IFIP TC10 WG10.5 INTERNATIONAL CONFERENCE ON VERY LARGE SCALE INTEGRATION 26–30 AUGUST 199

Ricardo A. Reis; Luc Claesen
Chapman and Hall (1997)
Kovakantinen kirja

301,50 €

VLSI: INTEGRATED SYSTEMS ON SILICON - IFIP TC10 WG10.5 INTERNATIONAL CONFERENCE ON VERY LARGE SCALE INTEGRATION 26–30 AUGUST 199

Ricardo A. Reis; Luc Claesen
Springer-Verlag New York Inc. (2013)
Pehmeäkantinen kirja

301,50 €

VLSI-SoC: Internet of Things Foundations : 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI

Luc Claesen (ed.), Maria-Teresa Sanz-Pascual (ed.), Ricardo Reis (ed.), Arturo Sarmiento-Reyes (ed.)

49,60 €

Springer
Sivumäärä: 241 sivua
Asu: Kovakantinen kirja
Julkaisuvuosi: 2015, 26.11.2015 (lisätietoa)
Kieli: Englanti
Tuotesarja: IFIP Advances in Information and Communication Technology 464

This book contains extended and revised versions of the best papers presented at
the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale
Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers
cover a wide range of topics in VLSI technology and advanced research. They
address the current trend toward increasing chip integration and technology
process advancements bringing about stimulating new challenges both at the
physical and system-design levels, as well as in the test of these systems.

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