Christian Boit | Akateeminen Kirjakauppa

Developments over the past six years have been covered in this expanded text, while previously covered topics have been revisited with a fresh perspective. New material includes fault isolation and characterization, as well as state-of-the-art techniques to analyze the die from the backside. This updated reference book, prepared by experts in their fields, contains 60 articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most frequently needed information on this subject at your fingertips. Contents: Overall View of Failure Analysis of Microelectronic Devices Test-and-Fail Verification Decapsulation and Package Analysis Electrical Techniques Electron/ Ion-Beam Based Techniques Thermal Techniques Photonic Techniques Soft-ware Techniques Deprocessing and Sample Preparation Physical / Chemical Defect Characterization Discrete / Passive Component Analysis Failure Modes and Mechanisms Advance Techniques Laboratory Operations and Management.