Kai-Ming G. Fu (ed.); Michael Y. Wang (ed.); Michael S. Virk (ed.); John R. Dimar II (ed.); Praveen V. Mummaneni (ed.) Springer (2023) Kovakantinen kirja
Kai-Ming G. Fu (ed.); Michael Y. Wang (ed.); Michael S. Virk (ed.); John R. Dimar II (ed.); Praveen V. Mummaneni (ed.) Springer (2024) Pehmeäkantinen kirja
Yong Shi (ed.); Haohuan Fu (ed.); Yingjie Tian (ed.); Valeria V. Krzhizhanovskaya (ed.); Michael Harold Lees (ed.); Dongarr Springer (2018) Pehmeäkantinen kirja
Yong Shi; Haohuan Fu; Yingjie Tian; Valeria V. Krzhizhanovskaya; Michael Harold Lees; Jack Dongarra; Peter M. A. Sloot Springer International Publishing AG (2018) Pehmeäkantinen kirja
Yong Shi (ed.); Haohuan Fu (ed.); Yingjie Tian (ed.); Valeria V. Krzhizhanovskaya (ed.); Michael Harold Lees (ed.); Dongarr Springer (2018) Pehmeäkantinen kirja
This is an agenda-setting and high-profile book that presents an authoritative and cutting-edge analysis of nanoscience and technology. The Oxford Handbook of Nanoscience and Technology provides a comprehensive and accessible overview of the major achievements in different aspects of this field. The Handbook comprises 3 volumes, structured thematically, with 25 chapters each. Volume I presents fundamental issues of basic physics, chemistry, biochemistry, tribology etc. of nanomaterials. Volume II focuses on the progress made with host of nanomaterials including DNA and protein based nanostructures. Volume III highlights engineering and related developments, with a focus on frontal application areas. All chapters are written by noted international experts in the field. The book should be useful for final year undergraduates specializing in the field. It should prove indispensable to graduate students, and serious researchers from academic and industrial sectors working in the field of Nanoscience and Technology from different disciplines including Physics, Chemistry, Biochemistry, Biotechnology, Medicine, Materials Science, Metallurgy, Ceramics, Information Technology as well as Electrical, Electronic and Computational Engineering.
