Jong Hoon Lee; Manos M. Tentzeris; Wei-Chung Weng; Fan Yang; John Holmes; Atef Z. Elsherbeni; Mohamed H. Al Sharkawy; Dem Morgan & Claypool Publishers (2010) Saatavuus: Hankintapalvelu Kovakantinen kirja
Changhoon Lee (ed.); Jean-Marc Seigneur (ed.); James J. (Jong Hyuk) Park (ed.); Roland R. Wagner (ed.) Springer (2011) Saatavuus: Tilaustuote Pehmeäkantinen kirja
James (Jong Hyuk) Park; Hsiao-Hwa Chen; Mohammed Atiquzzaman; Changhoon Lee; Sang-Soo Yeo Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2009) Saatavuus: Tilaustuote Pehmeäkantinen kirja
James (Jong Hyuk) Park (ed.); Justin Zhan (ed.); Changhoon Lee (ed.); Guilin Wang (ed.); Sang-Soo Yeo (ed.) Springer (2009) Saatavuus: Tilaustuote Pehmeäkantinen kirja
James J. (Jong Hyuk) Park; Laurence T. Yang; Changhoon Lee Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2011) Saatavuus: Tilaustuote Pehmeäkantinen kirja
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.
Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.