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Jong-Won Lee | Akateeminen Kirjakauppa

Haullasi löytyi yhteensä 17 tuotetta
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EMBEDDED SOFTWARE AND SYSTEMS - THIRD INTERNATIONAL CONFERENCE, ICESS 2007, DAEGU, KOREA, MAY 14-16, 2007, PROCEEDINGS

Yann-Hang Lee; Heung-Nam Kim; Jong Kim; Yongwan Park; Laurence T. Yang; Sung Won Kim
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2007)
Pehmeäkantinen kirja

101,40 €

PROGRESS IN CORROSION SCIENCE AND ENGINEERING I

Su-Il Pyun; Jong-Won Lee
Springer-Verlag New York Inc. (2009)
Kovakantinen kirja

134,60 €

PROGRESS IN CORROSION SCIENCE AND ENGINEERING II

Su-Il Pyun; Jong-Won Lee
Springer-Verlag New York Inc. (2012)
Kovakantinen kirja

101,40 €

ELECTROCHEMISTRY OF INSERTION MATERIALS FOR HYDROGEN AND LITHIUM

Su-Il Pyun; Heon-Cheol Shin; Jong-Won Lee; Joo-Young Go
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2012)
Kovakantinen kirja

101,40 €

RADIOLOGY ILLUSTRATED: SPINE

Heung Sik Kang; Joon Woo Lee; Jong Won Kwon
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2014)
Kovakantinen kirja

223,50 €

PROGRESS IN CORROSION SCIENCE AND ENGINEERING I

Su-Il Pyun; Jong-Won Lee
Springer-Verlag New York Inc. (2014)
Pehmeäkantinen kirja

111,40 €

PROGRESS IN CORROSION SCIENCE AND ENGINEERING II

Su-Il Pyun (ed.); Jong-Won Lee (ed.)
Springer (2014)
Pehmeäkantinen kirja

113,50 €

ELECTROCHEMISTRY OF INSERTION MATERIALS FOR HYDROGEN AND LITHIUM

Su-Il Pyun; Heon-Cheol Shin; Jong-Won Lee; Joo-Young Go
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2014)
Pehmeäkantinen kirja

101,40 €

RADIOLOGY ILLUSTRATED: SPINE

Heung Sik Kang; Joon Woo Lee; Jong Won Kwon
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2016)
Pehmeäkantinen kirja

161,20 €

THE COMMUNITY OF ASIA - CONCEPT OR REALITY?

Urvashi Butalia; Jong Won Lee; Masaaki Ohashi; Karina A. Bolasco
Anvil Publishing, Inc. (2007)
Pehmeäkantinen kirja

111,90 €

APPLIED NUMERICAL METHODS USING MATLAB

Won Y. Yang; Wenwu Cao; Jaekwon Kim; Kyung W. Park; Ho-Hyun Park; Jingon Joung; Jong-Suk Ro; Han L. Lee; Cheol-Ho Hong
John Wiley & Sons Inc (2020)
Kovakantinen kirja

149,30 €

I'M A LITTLE SCIENTIST! (SET 2)

Won-seop Kim; Sun-ah Ko; Jong-hyun Lee
World Scientific Publishing Co Pte Ltd (2022)
Kovakantinen kirja

48,20 €

I'M A LITTLE SCIENTIST! (SET 2)

Won-seop Kim; Sun-ah Ko; Jong-hyun Lee
World Scientific Publishing Co Pte Ltd (2022)
Pehmeäkantinen kirja

24,20 €

GROUNDWATER RECHARGE AS AFFECTED BY CLIMATE CHANGE

Lee Moung Jin; Lee Jongho; Won Joongsun
LAP Lambert Academic Publishing (2012)
Pehmeäkantinen kirja

85,70 €

DATABASE SYSTEMS FOR ADVANCED APPLICATIONS - 25TH INTERNATIONAL CONFERENCE, DASFAA 2020, JEJU, SOUTH KOREA, SEPTEMBER 24–27, 202

Yunmook Nah; Bin Cui; Sang-Won Lee; Jeffrey Xu Yu; Yang-Sae Moon; Steven Euijong Whang
Springer Nature Switzerland AG (2020)
Pehmeäkantinen kirja

101,40 €

DATABASE SYSTEMS FOR ADVANCED APPLICATIONS - 25TH INTERNATIONAL CONFERENCE, DASFAA 2020, JEJU, SOUTH KOREA, SEPTEMBER 24–27, 202

Yunmook Nah; Bin Cui; Sang-Won Lee; Jeffrey Xu Yu; Yang-Sae Moon; Steven Euijong Whang
Springer Nature Switzerland AG (2020)
Pehmeäkantinen kirja

125,70 €

DATABASE SYSTEMS FOR ADVANCED APPLICATIONS - 25TH INTERNATIONAL CONFERENCE, DASFAA 2020, JEJU, SOUTH KOREA, SEPTEMBER 24–27, 202

Yunmook Nah; Bin Cui; Sang-Won Lee; Jeffrey Xu Yu; Yang-Sae Moon; Steven Euijong Whang
Springer Nature Switzerland AG (2020)
Pehmeäkantinen kirja

101,40 €

Hae lisää...

Embedded Software and Systems - Third International Conference, ICESS 2007, Daegu, Korea, May 14-16, 2007, Proceedings

Yann-Hang Lee, Heung-Nam Kim, Jong Kim, Yongwan Park, Laurence T. Yang, Sung Won Kim

101,40 €

Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Sivumäärä: 829 sivua
Asu: Pehmeäkantinen kirja
Painos: 2007 ed.
Julkaisuvuosi: 2007, 08.05.2007 (lisätietoa)
Kieli: Englanti
Tuotesarja: Programming and Software Engineering

This book constitutes the refereed proceedings of the Third International Conference on Embedded Software and Systems, ICESS 2007, held in Daegu, Korea, May 2007. The 75 revised full papers cover embedded architecture, embedded hardware, embedded software, HW-SW co-design and SoC, multimedia and HCI, pervasive/ubiquitous computing and sensor network, power-aware computing, real-time systems, security and dependability, and wireless communication.

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