Li Gan; Zhichao Yin; Nan Jia; Shu Xu; Shuang Ma; Lu Zheng Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2013) Saatavuus: Tilaustuote Kovakantinen kirja
Z Z Gan; R Q Han; Hou-zhi Zheng; Bang-fen Zhu; Jian-bai Xia; G G Qin; Guo Zhen Yang; Z T Zhong World Scientific Publishing Co Pte Ltd (1989) Saatavuus: Painos loppu Kovakantinen kirja
Li Gan; Zhichao Yin; Nan Jia; Shu Xu; Shuang Ma; Lu Zheng Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2015) Saatavuus: Tilaustuote Pehmeäkantinen kirja
McGraw Hill Asu: Kovakantinen kirja Julkaisuvuosi: 2013, 16.11.2012 (lisätietoa) Kieli: Englanti
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Proven processes for ensuring semiconductor device reliability
Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.
Coverage includes:
Basic device physics
Process flow for MOS manufacturing
Measurements useful for device reliability characterization
Hot carrier injection
Gate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)
Negative bias temperature instability
Plasma-induced damage
Electrostatic discharge protection of integrated circuits
