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Daniel Lu | Akateeminen Kirjakauppa

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MATERIALS FOR ADVANCED PACKAGING

Daniel Lu; C.P. Wong
Springer-Verlag New York Inc. (2008)
Kovakantinen kirja

147,10 €

INSAR IMAGING OF ALEUTIAN VOLCANOES - MONITORING A VOLCANIC ARC FROM SPACE

Zhong Lu; Daniel Dzurisin
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2014)
Kovakantinen kirja

172,80 €

MATERIALS FOR ADVANCED PACKAGING

Daniel Lu; C. P. Wong
Springer-Verlag New York Inc. (2010)
Pehmeäkantinen kirja

129,80 €

ADVANCED HYPERSONIC TEST FACILITIES

Frank K. Lu; Daniel E. Marren
American Institute of Aeronautics & Astronautics (2002)
Kovakantinen kirja

128,00 €

MOBILE LEARNING DESIGN - THEORIES AND APPLICATION

Daniel Churchill; Jie Lu; Thomas K.F. Chiu; Bob Fox
Springer Verlag, Singapore (2015)
Kovakantinen kirja

97,90 €

MATERIALS FOR ADVANCED PACKAGING

Daniel Lu; C.P. Wong
Springer International Publishing AG (2016)
Kovakantinen kirja

241,40 €

FAST UNCOVERING OF GRAPH COMMUNITIES ON A CHIP - TOWARD SCALABLE COMMUNITY DETECTION ON MULTICORE AND MANYCORE PLATFORMS

Ananth Kalyanaraman; Mahantesh Halappanavar; Daniel Chavarría-Miranda; Hao Lu; Karthi Duraisamy; Partha Pratim Pande
now publishers Inc (2016)
Pehmeäkantinen kirja

82,70 €

INSAR IMAGING OF ALEUTIAN VOLCANOES - MONITORING A VOLCANIC ARC FROM SPACE

Zhong Lu; Daniel Dzurisin
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG (2016)
Pehmeäkantinen kirja

172,80 €

LEADING AN ACADEMIC MEDICAL PRACTICE

Lee Bach Lu (ed.); Ernie-Paul Barrette (ed.); Craig Noronha (ed.); Halle G. Sobel (ed.); Daniel G. Tobin (ed.)
Springer (2018)
Pehmeäkantinen kirja

78,60 €

MATERIALS FOR ADVANCED PACKAGING

Daniel Lu; C.P. Wong
Springer International Publishing AG (2018)
Pehmeäkantinen kirja

172,80 €

MOBILE LEARNING DESIGN - THEORIES AND APPLICATION

Daniel Churchill; Jie Lu; Thomas K.F. Chiu; Bob Fox
Springer Verlag, Singapore (2019)
Pehmeäkantinen kirja

97,90 €

COLLECTIVE BEHAVIOR IN COMPLEX NETWORKED SYSTEMS UNDER IMPERFECT COMMUNICATION

Jianquan Lu; Lulu Li; Daniel W.C. Ho; Jinde Cao
Springer Verlag, Singapore (2021)
Kovakantinen kirja

126,80 €

ZWEIHEIMISCH

Rahel Lüönd; Daniel Schriber
Édition De Caro (2021)
Kovakantinen kirja

43,70 €

COLLECTIVE BEHAVIOR IN COMPLEX NETWORKED SYSTEMS UNDER IMPERFECT COMMUNICATION

Jianquan Lu; Lulu Li; Daniel W.C. Ho; Jinde Cao
Springer Verlag, Singapore (2022)
Pehmeäkantinen kirja

126,80 €

LEADING AN ACADEMIC MEDICAL PRACTICE

Lee B. Lu; Robert J. Fortuna; Craig F. Noronha; Halle G. Sobel; Daniel G. Tobin
Springer International Publishing AG (2024)
Pehmeäkantinen kirja

121,30 €

ELECTRICAL CONDUCTIVE ADHESIVES WITH NANOTECHNOLOGIES

Yi Li (Grace); Daniel Lu; C.P. Wong
Springer-Verlag New York Inc. (2009)
Kovakantinen kirja

147,10 €

ELECTRICAL CONDUCTIVE ADHESIVES WITH NANOTECHNOLOGIES

Yi Li; Daniel Lu; C. P. Wong
SPRINGER VERLAG GMBH (2009)
Pehmeäkantinen kirja

66,10 €

MECHANICAL BEHAVIOR AT SMALL SCALES–EXPERIMENTS AND MODELING: VOLUME 1224

Jun Lou; Erica Lilleodden; Brad L. Boyce; Lei Lu; Peter M. Derlet; Daniel Weygand; Ju Li; Michael Uchic; Eric L Bourhis
Materials Research Society (2010)
Kovakantinen kirja

123,90 €

ELECTRICAL CONDUCTIVE ADHESIVES WITH NANOTECHNOLOGIES

Yi Li (Grace); Daniel Lu; C.P. Wong
Springer-Verlag New York Inc. (2014)
Pehmeäkantinen kirja

147,10 €

HUMAN DEVELOPMENTAL RESEARCH - EXPERIENCE FROM RESEARCH IN HONG KONG

Daniel T L Shek; Cecilia Ma; Yu Lu; Joav Merrick
Nova Science Publishers Inc (2013)
Kovakantinen kirja

307,00 €

Hae lisää...

Materials for Advanced Packaging

Daniel Lu, C.P. Wong

147,10 €

Springer-Verlag New York Inc.
Sivumäärä: 724 sivua
Asu: Kovakantinen kirja
Painos: 2009
Julkaisuvuosi: 2008, 10.12.2008 (lisätietoa)
Kieli: Englanti

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

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