Bo Pan | Akateeminen Kirjakauppa

This forward-looking resource presents the latest details on smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications. Engineers find comprehensive details on LCP (liquid crystal polymers), metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives.